This device applies vacuum tape under a vacuum for mounting of workpieces and tape/film.
Simple set the dicing frame and workpiece with dicing tape applied, and operate the switches to mount tape to workpiece.
We can demonstrate our products.
Consult with us if you are interested to make samples.
8 inch | 12 inch | |
---|---|---|
Dimensions | W500 × D770 × H1010(㎜) (with adjuster) |
W613 × D873 × H1035(㎜) (with adjuster) |
Weight | Approx. 110 kg | Approx. 150 kg |
Recipe settings | Choose from 10 types | Choose from 10 types |
Work pieces suitable for processing | 2inch∼8inch Wafer substrate 5inch∼8inch Dicing Frame |
8inch . 12inch Wafer substrate 8inch . 12inch Dicing Frame |
Tape used | Various tapes | Various tapes |
Vacuum source | Dry pump | Dry pump |
Dry air | 0.5Mpa or more 150L/min(ANR) | 0.5Mpa or more 150L/min(ANR) |
Power source | AC200V 50/60Hz 15A (3-phase) | AC200V 50/60Hz 15A (3-phase) |