Semiconductor and Electronic component production equipment

Wafer Expander

Compatible with stealth dicer
Face-Down Expander

OEX-FD-series

We suggest completely dry processing
Cutting using particle free processing with
Face-Down specifications is possible

Outline
Features
Specifications

Outline

Use of Face-Down expansion and forced suction from stage base greatly reduces Si particle adherence produced when cutting.
In comparison with conventional methods, yield rate can be improved and processing can be reduced.
Additionally, use of motor drive provides precision splitting with low speed and short strokes,and provides superior processing of fragile workpieces such as MEMS.

time：2min 6sec

Features

Completely dry processing

With the wafer set face down and forced suction of Si particle produced during cutting, adhesion to the workpiece is greatly eliminated. Completely dry processing can be applied to MEMS, CMOS and similar wafers that cannot be subjected to wet cleaning.

Setting of precise conditions is possible

Adoption of motor drive system allows for setting of precise conditions.Expansion stroke, speed and similar conditions canbe easily operated using the touch panel.
Fragile workpieces can be cut with high quality and without breakage.

Supports fully automatic operation

This product even supports a full automatic mode, with a loader and unloader equipped.
This gets rid of the unevenness that resulted from manual work.

Automatic cutting function

The automatic cutting function saves on work loads and improves uniformity.
Can cut in both low and high strokes.

Specifications

８inch

12inch

Dimensions	W700 × D1250 × H1470(㎜)	W820 × D1800 × H1680(㎜)
Weight	Approx. 250kg	Approx. 500kg
Expand stroke	7mm ～ 50mm / Stopping precision ±0.1mm	8mm ～ 50mm / Stopping precision ±0.1mm
Vertical speed	0.1 ～ 20mm/sec 0.1 mm/sec can be adjusted in units of 0.1 mm/s	0.1 ～ 100mm/sec 0.1 mm/sec can be adjusted in units of 0.1 mm/s
Temperature adjustment	Room temperature ～ 80°C
Size	8inch Dicing Frame	12inch Dicing Frame
Air	0.4 ～ 0.5Mpa 10L/min φ8 one touch connector
Power Supply	AC100V 50/60Hz 10A	AC200V 50/60Hz 30A