It is a device that dries water droplets and moisture on the wafer by the action of centrifugal force due to rotation and air flow sucked.

It is a device that bidirectionally transfers wafers from carrier to carrier or carrier to boat.

It is a device that cleans and dries wafer carriers and carrier boxes.

Wafer Mounters have 2 functions of laminating and mounting.

BG Tape Laminators automatically paste back grinding tapes for surface protection.

Tape Removers remove protection films such as back grinding tapes attached on a wafer or a substrate by using peeling tapes.

UV Curing Systems emit UV radiation to and cure UV curing tapes/films.

Wafer Expanders perform grip rings fitting and tape cutting with one touch operation.

This easy-to-operate field balancer measures the dynamic balance of rotating equipment or grinding machines and correct the balance.

Attached to a grinding machine or rotating equipment, the device performs the automatic dynamic balancing. With I/O control, the whole process can be automated.

Can be customized to meet your requirements, based on the original technology.

All you need to do is set a workpiece! Detects the weight and position of unbalance without rotating the workpiece.

Performs the touch detection with submicron precision for NC machine tools or general-purpose machine tools, and saves air-cutting time.

Our specialized engineers will perform the on-site field balancing or in-house balance correction of your workpiece.