Full-Auto BG Tape Laminator
It is an automatic equipment capable of circumference cutting after paste the back grinding tape for surface protection under tension control. We have adopted our own roller structure for pasting, pasting in a state with almost no tension to the tape has been realized, it is effective in reducing warping of thin wafers after surface grinding.
By adopting our own pasting rollers, we realize sticking with low tension.Reduce warp / damage trouble after back grinding.
Without sticking out of from the outer periphery of the wafer, It reduce the trouble in the Back Grind process.
It corresponds to high bump tape which is essential item of WL-CSP process.
|BG tape model No||BG thickness||Wafer No,|
|SB-135S-BN-R2||① 100 µｍ||1||0.9||2.0||0|
|② 50 µｍ||3||3.6||7.0||0.5|
|① 100 µｍ||5||1.0||2.0||0|
|② 50 µｍ||7||4.1||8.0||0.5|