Semiconductor and Electronic component production equipment
BG Tape Laminator
Full-Auto BG Tape Laminator
OTL-series
“The New” Tension Control For Back Grinding !!
Outline
It is an automatic equipment capable of circumference cutting after paste the back grinding tape for surface protection under tension control. We have adopted our own roller structure for pasting, pasting in a state with almost no tension to the tape has been realized, it is effective in reducing warping of thin wafers after surface grinding.
Features
Low tension laminating
By adopting our own pasting rollers, we realize sticking with low tension.Reduce warp / damage trouble after back grinding.
High precision circumference cut
Without sticking out of from the outer periphery of the wafer, It reduce the trouble in the Back Grind process.
Supports high bump tape
It corresponds to high bump tape which is essential item of WL-CSP process.
Warpage after back grinding
| BG tape model No | BG thickness | Wafer No, | |||
|---|---|---|---|---|---|
| AVE | MAX | MIN | |||
| SB-135S-BN-R2 | ① 100 µｍ | 1 | 0.9 | 2.0 | 0 |
| 2 | 1.0 | 2.0 | 0 | ||
| ② 50 µｍ | 3 | 3.6 | 7.0 | 0.5 | |
| 4 | 3.8 | 8.0 | 0.5 | ||
| ① 100 µｍ | 5 | 1.0 | 2.0 | 0 | |
| 6 | 1.1 | 2.0 | 0 | ||
| ② 50 µｍ | 7 | 4.1 | 8.0 | 0.5 | |
| 8 | 4.0 | 8.0 | 0.5 | ||
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