Tape Remover Outline

Line up and Specifications

• Manual Type

  OTR-M-series
  
• Semi Automatic Type

  OTR-SA-series
  
• Ultrasonic Tape Type

  OTR-FA-series
  
• Fully Automatic Type

  OTR-FA-series
  

Tape Remover

• Manual Type

  OTR-M-series

  This manual tape remover is a device used for the manual removal of protection films attached to wafers and printed circuit boards.

  

  Work pieces suitable	Wafer and PCB with tapes
  Wafer size	8inchタイプ ：2～8 inch 12inchタイプ ：2～12 inch
  Dimensions	8inch　Type ：W500 × D810 × H430(㎜) 12inch　Type：W650 × D980 × H430(㎜)
  Weight	8inch　Type ：Approx. 30 ㎏ 12inch　Type：Approx. 70 ㎏
  Type	Manual

  See detailed features
• Semi Automatic Type

  OTR-SA-series

  This device semiautomatically removes protection tape like BG tape from wafer/substrate.

  

  Work pieces suitable	Wafer and PCB with tapes
  Wafer size	6inch・8inch　/　8inch・12inch
  Dimensions	W680 × D910 × H850(㎜)
  Weight	Approx. 70 kg ～ 80 kg
  Type	Semi Automatic

  See detailed features
• Ultrasonic Tape

  OTR-FA-series

  This is a Full auto tape remover with a UV irradiation system (scanning system) for removing protection tapes attached to dicing rings and wafers.

  

  Work pieces suitable	6、8inch　Wafer / 8inch　Dicing frame
  Wafer size	5inch　Type ：4、5inch 8inch　Type ：6、8inch
  Dimensions	5inch　Type ：Ｗ2670 × Ｄ1080 × Ｈ1800(㎜) 8inch　Type ：Ｗ2900 × Ｄ1300 × Ｈ1800(㎜)
  Weight	5inch　Type ：Approx. 1500 ㎏ 8inch　Type ：Approx. 1800 ㎏
  Type	Fully Automatic / Semi Automatic

  See detailed features
• Fully Automatic Type

  OTR-FA-series

  Full auto tape remover is a device for peeling off protective film applied to wafers.

  

  Work pieces suitable	Wafer with BG tape and other protective films
  Dimensions	Ｗ2200 × Ｄ1150 × Ｈ1800(㎜)
  Type	Fully Automatic

  See detailed features