Semiconductor and Electronic component production equipment
Wafer Expander
Wafer Expander Outline
Wafer Expanders perform expanding, grip rings fitting, and tape cutting with one touch operation.
Equipped with a motor with stopping accuracy, automatic tape cutting function, and high-stroke function as the standard specifications. Can be used for multiple purposes from development, testing, and mass-production. With “high-speed expand” function (option), you can set more conditions, which will be most suitable for product development.
Line up and Specifications
Wafer Expander
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Semi Automatic TypeOEX-SA-series
Performs expanding, grip rings fitting, and tape cutting with one touch operation.
Work pieces suitable 8inch Frame size 8inch Dicing frame Dimensions W480 × D600 × H564(㎜) Weight Approx. 60 kg Type Semi Automatic -
Face-Down TypeOEX-FD-series
Prevents Si particles from sticking to a wafer by face-down expanding and vacuuming downward.
Work pieces suitable 8inch Frame size 8inch Dicing frame Dimensions W700 × D1250 × H1470(㎜) Weight Approx. 250 Kg Type Face-Down -
Fully Automatic TypeOEX-FA-series
Expands dicing tapes after the dicing process.
Work pieces suitable 8inch Dicing framee / Grip ring Frame size 8inch Dicing framee / Grip ring Dimensions W2400 × D1700 × H1800(㎜) Weight Approx. 1500 kg Type Fully Automatic
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