Semiconductor and Electronic component production equipment

Wafer Expander

Wafer Expander Outline

Wafer Expanders perform expanding, grip rings fitting, and tape cutting with one touch operation.
Equipped with a motor with stopping accuracy, automatic tape cutting function, and high-stroke function as the standard specifications. Can be used for multiple purposes from development, testing, and mass-production. With “high-speed expand” function (option), you can set more conditions, which will be most suitable for product development.

Wafer Expander

  • Semi Automatic Type
    OEX-SA-series

    Performs expanding, grip rings fitting, and tape cutting with one touch operation.

    Work pieces suitable 8inch
    Frame size 8inch Dicing frame
    Dimensions W480 × D600 × H564(㎜)
    Weight Approx. 60 kg
    Type Semi Automatic
  • Face-Down Type
    OEX-FD-series

    Prevents Si particles from sticking to a wafer by face-down expanding and vacuuming downward.

    Work pieces suitable 8inch
    Frame size 8inch Dicing frame
    Dimensions W700 × D1250 × H1470(㎜)
    Weight Approx. 250 Kg
    Type Face-Down
  • Fully Automatic Type
    OEX-FA-series

    Expands dicing tapes after the dicing process.

    Work pieces suitable 8inch Dicing framee / Grip ring
    Frame size 8inch Dicing framee / Grip ring
    Dimensions W2700 × D1700 × H1800(㎜)
    Weight Approx. 800 kg
    Type Fully Automatic

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