
We manufacture and sell Front End Process Equipment and Dicing Environmental Equipment in the semiconductor and electronic component production industries.
Spin Dryers, typically used in the final process in Wet process (cleaning or coating), are examples of Front End Process Equipment.
Wafer Mounters or Wafer Expanders are examples of Dicing Environmental Equipment.
It is a device that dries water droplets and moisture on the wafer by the action of centrifugal force due to rotation and air flow sucked.
It is a device that bidirectionally transfers wafers from carrier to carrier or carrier to boat.
It is a device that cleans and dries wafer carriers and carrier boxes.
BG Tape Laminators automatically paste back grinding tapes for surface protection.
Tape Removers remove protection films such as back grinding tapes attached on a wafer or a substrate by using peeling tapes.
Wafer Mounters have 2 functions of laminating and mounting.
Tape Removers remove protection films such as back grinding tapes attached on a wafer or a substrate by using peeling tapes.
Wafer Expanders perform grip rings fitting and tape cutting with one touch operation.
UV Curing Systems emit UV radiation to and cure UV curing tapes/films.
Chip Transfers, with the original technology, transfer a wafer mounted on a dicing frame to another.