Semiconductor and Electronic component production equipment

Wafer Expander

Fully Automatic Wafer Expander

OEX-FA-series

High precision, low particle generation,
0-mm expanding
Applicable to a variety of expanding conditions.

Outline
process flow
Features
Specifications

Outline

Full Automatic Wafer Expanders expand dicing tapes after the dicing process.
dicing tapes after the dicing process.
Automatic operation is performed from chip separation, expanding, grip rings fixing, tape cutting, and separating from dicing frame.

process flow

Take out a dicing frame supplied by a cassette, and the operations from tape heating, expanding, grip rings fitting, and dicing tape cutting (separating from dicing frame) are performed.
Grip rings separated from the dicing frame will be stored in a grip rings cassette. The dicing frame will be stored in a dicing frame cassette.

Features

Frame inverting function (Face-down expanding) Patent pending

Makes fragments fall downward generated at expanding so as not to stick to wafer chips.

High precision expanding stage

Uniform and continuous performance with motor control
・Stage stroke: 0 to 50 mm
・Expanding speed: 0.1 mm/s
A wide variety of expanding recipes can be set such as low-stroke expanding or low-speed expanding. (Patent pending)

Static elimination

A spot-type ionizer blows the air to a workpiece during the expanding process. Prevents particle generation on a workpiece.

Stage temperature adjustment

Stage temperature can be adjusted up to 80 °C.

Specifications

８inch

12inch

Dimensions	W2400 × D1700 × H1800(㎜)	W3200 × D2350 × H2100(㎜)
Weight	Approx. 1500kg	Approx. 2000kg
Work size	8inch Dicing frame 8inch Grip-ring	12inch Dicing frame 12inch Grip-ring
Air	0.4Mpa　150L/min(ANR)more	0.4Mpa　300L/min(ANR)more
Power source	AC200V　50/60Hz　50A