Semiconductor and Electronic component production equipment
Wafer Expander
Semi Automatic Wafer Expander
OEX-SA-series
Uniform speed, uniform strokes
Despite the compact body of a table-top type,
it's even equipped with an automatic cutting function
Despite the compact body of a table-top type,
it's even equipped with an automatic cutting function
time：1min 27sec
Outline
This expander with auto-cutter function is a table-top device used for expanding and splitting post-dicing wafers and die, fitting grip-rings, and cutting excess tape.
Function
High precision expanding by motor control!! Height adjustment in 0.1 mm unit and speed control in 0.1 mm/s. With its high-resolution control, precise movement such as expanding (chip expansion) or wafer dividing (breaking) can be performed.
Equipped with the automatic tape cutting function, grip rings fitting, expanding, and tape cutting can be performed with one touch operation. There will be no individual variations, human errors, or excess work.
How to operation
Set grip rings (inner ring and outer ring) and a dicing frame and lock them.
All you need is to press the start button. You can adjust table heater temperature as necessary.
Features
High precision expanding
High precision expanding by motor control. Excellent expanding performance!
Simple and accurate adjustment of speed or height
Expanding stroke and speed can be set on the touch panel.
Number management prevents production variation.
Stage temperature control
With the built-in heater, stage temperature can be adjusted from room temperature to 80 °C, which will make tapes expand well.
Compact size
Compact for semiautomatic models with the automatic tape cutting function!
Supports fully automatic operation
High precision expanding by motor control!!
Specifications
 |
| 8inch | 12inch | |
|---|---|---|
| Dimensions | W480 × D600 × H564(㎜) | W600 × D720 × H648(㎜) |
| Weight | Approx. 60 kg | Approx. 80 kg |
| Expand stroke | 10mm ～ 55mm stage stop accuracy:±0.1mm | 10mm ～ 55mm stage stop accuracy:±0.1mm |
| Vertical speed | 1 ～ 20mm/sec (can be adjusted in units of 0.1 mm/s) | 1 ～ 20mm/sec (can be adjusted in units of 0.1 mm/s) |
| Temperature adjustment | Room temperature ∼ 80°C | Room temperature ∼ 80°C |
| Size | 8inch Dicing Frame | 12inch Dicing Frame |
| Air | 0.4 ～ 0.5Mpa or more 5L/min more | 0.4 Mpa or more 10L/min more |
| Power Supply | AC100V 50/60Hz 10A | AC220V ±10％ 50/60Hz 20A |
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