
The Chip Transfer machine is a equipment that transfers the wafer mounted on the dicing frame to another frame by its original.
Vacuum transfer technology (patent) realized a process that reduced pressure stress and bubbles accompanying roller transfer.
The peeling unit of the transferred film has its own tapeless function.
It reduces manual troublesome peeling work and running costs.
We also support fully automated transfer process!!
It is possible to eliminate variations in quality and human errors due to manual
operation.