Semiconductor and Electronic component production equipment

Tape Remover

Fully Automatic Tape Remove

OTR-FA-series

Fully automated machine for peeling BG tape!!
With orientation flat alignment and centering function.

Outline
Features
Specifications

Outline

The full auto tape remover is a device for peeling off protective film applied to wafers.
The wafer that is fed by cassette is positioned in the aligner, tape is removed and the wafer is ejected to the same cassette.

Features

Thin wafer handling

Through adopting a unique peeling mechanism and total area suction table, the device can also be used with thin wafers by keeping stress on the wafer to a minimum.

Alignment function

Before peeling, orientation flat and notch angle positioning and centering are performed on the alignment table in order to prevent poor tape removal due to misalignment.

Tact adjustment function

The tape peeling speed and carrying speed, etc. can be set by touch panel.
Adjustments can be made according to the work.

Static electricity countermeasures

An ionizer is fitted as a standard feature.

Tape end detection

The device uses a sensor to detect the remaining amount of peeling tape.
An alarm is sounded when there is only 5 m left (the setting can be changed), thereby preventing any unnecessary device stoppages.

Specifications

Dimensions	W2200 × D1500 × H1800(㎜)
Size of wafers for use	Wafer with BG tape and other protective films
Cycle time	120sec / pc.
Drive air	0.4MPa or more、150L/min（ANR） more
Vacuum source	Plant vacuum source and vacuum-ejector is used
Power source	3-Phase　200V　30A

Wafer sticking out detection function: Detects wafers sticking out from a cassette.
Prevents cracking by hand during transport
Safety: mechanical door lock system and some interlock , signal tower
Option: FFU(HEPA Unit) , Host communication system