Fully Automatic Ultrasonic Tape Remove
This is a fully automatic tape remover with a UV irradiation system (scanning system) for removing protection tapes attached to dicing rings and wafers.
An ultrasonic adhesion head is installed to the remover unit for the first time in the industry.
Tape removal without removal tapes is possible. (patented)
Uniquely designed removal unit eliminates the use of removal tapes which used to be a common practice in the industry.
The cost for such removal tapes is "$0"!
A compact design realized by minimizing the foot space.
It is possible to customize the equipment based on the work pieces to be processed. For example, a table with a built-in heater and a thin work carrier arm.
Elimination of the use of tapes also reduces waste. This contributes to the CO2 reduction activities of companies.
Operation system | Full auto | |
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Dimensions | W2900 × D1300 × H1800(㎜) | |
Weight | Approx. 1800 kg | |
Applicable work pieces | ~8inch wafer / ~8inch Dicing frame | |
Chuck table | contact type or Non-contact type(option) | |
Power source | 3-Phase AC200V |