Semiconductor and Electronic component production equipment

Tape Remover

Fully Automatic Ultrasonic Tape Remove

OTR-FA-series
A revolutionary new machine for manual removing!!
Simple and easy removal operation
超音波テープレスリームーバー

Outline

This is a fully automatic tape remover with a UV irradiation system (scanning system) for removing protection tapes attached to dicing rings and wafers.
An ultrasonic adhesion head is installed to the remover unit for the first time in the industry.
Tape removal without removal tapes is possible. (patented)

Features

Tape-less

Uniquely designed removal unit eliminates the use of removal tapes which used to be a common practice in the industry.
The cost for such removal tapes is "$0"!

Compact design

A compact design realized by minimizing the foot space.

Customized configuration

It is possible to customize the equipment based on the work pieces to be processed. For example, a table with a built-in heater and a thin work carrier arm.

Environment friendly

Elimination of the use of tapes also reduces waste. This contributes to the CO2 reduction activities of companies.

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Specifications

Fully Automatic 
Operation system Full auto
Dimensions W2900 × D1300 × H1800(㎜)
Weight Approx. 1800 kg
Applicable work pieces ~8inch wafer / ~8inch Dicing frame
Chuck table contact type or Non-contact type(option)
Power source 3-Phase AC200V

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