Semiconductor and Electronic component production equipment

Tape Remover

Semi Automatic Tape Remover

OTR-SA-series
High performance of tape removal!
Supports excellent and stable quality of your products.
セミオートTape Remover
工具レスでテープ交換できます テープ押さえ
time:1min 35sec

Outline

This device semiautomatically removes protection tape like BG tape from wafer/substrate.

Features

Easy operation & Space saving design !

簡単操作&省スペース設計!

Easy switch operation after workpiece setting.Realizes stable tape removal, without requiring special skills.
Space-saving design gives you more installation choices.

Interlock system

各種インターロック

Start conditions like wafer presence, suction pressure, safety cover, or table temperature can be set.

Applicable to various workpieces

各種ワークに対応

Table can be customized to various workpieces.
Applicable to big, thin, or warped wafer with its full-face contact suction.
Easy tape replacement is effective in your production line of a wide variety of products.

Specifications

    Semi Automatic
Dimensions W680 × D910 × H850(㎜)
Weight Approx. 70kg ~ 80 kg
Work to be covered Wafer and PCB with tapes
Wafer size 6inch・8inch / 8inch・12inch
Applicable tapes BG tapes and other protective films Wide:50∼100mm
Table spec. A5056 Teflon coating / Porous[Option]
Drive air 0.5Mpa Φ6 one touch connector
Power source AC 100V 10A with power cable (3m)

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