Semiconductor and Electronic component production equipment

Wafer Mounter

Full Automatic Wafer Mounter

OTM-FA-series
Flexible to requirements
フルオートウエハマウンター

Outline

Full Automatic Wafer Mounters mount a tape on a wafer and a dicing frame (tape frame) before the dicing process.

The automatic operation will be conducted from wafer taking out, alignment, tape mounting on dicing frame, tape mounting on wafer, and to storing in a magazine.


  • Tape cutting inside the device
  • Applicable to rolled tapes/precut tapes.
  • Simple touch panel operation
  • A variety of tape mounting or storage patterns as recipes
  • Vacuum mounting unit can be added (Option)
  • Protection tape removing mechanism can be added. (Option)
  • UV irradiation unit for BG tapes can be added. (Option)
  • Applicable to workpieces other than wafers (Option)

Features

Tape mounting with non-contact pattern surface

Tape mounting with non-contact pattern surface

Tape mounting with non-contact pattern surface is available.
Prevents damage from suction. Best for fragile wafers such as thin wafers or MEMS.

Non-contact alignment for different sizes

異サイズ兼用非接触アライメント

OKK's original non-contact method
By sucking a few mm range along the periphery, it prevents risks from leaving suction marks or particles on pattern surfaces. No worry about edge damaged by clamping.

Handling with non-contact pattern surface

Handling with non-contact pattern surface

Non-contact handling is available.
Applicable to various robot hands such as periphery suction hand or Bernoulli suction hand. We can propose a method how to handle a warped wafer, based on verification.

Tape mounting

Tape mounting

We propose a unique method which saves the tape consumption and minimize the risk of dicing frames (tape frames) being damaged or metal powder being generated due to the contact between frames and cutters.
Applicable to different sizes and different tapes by a variety of recipe settings.

A variety of models are lined up. Contact us for details.

A variety of models are lined up. Contact us for details.

Applicable to various sizes of workpiece: For 4-,6-in, for 4-,5-,6-,8-in, for 6-,8-in
Option: Can be equipped with tape removing mechanism, UV irradiation unit, or vacuum mounting unit.

Selectable tape cutting technology

time:1min 34sec
time:46sec

CONTACT

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