
Full Automatic Wafer Mounters mount a tape on a wafer and a dicing frame (tape frame) before the dicing process.
The automatic operation will be conducted from wafer taking out, alignment, tape mounting on dicing frame, tape mounting on wafer, and to storing in a magazine.
Tape mounting with non-contact pattern surface is available.
Prevents damage from suction. Best for fragile wafers such as thin wafers or MEMS.
OKK's original non-contact method
By sucking a few mm range along the periphery, it prevents risks from leaving suction marks or particles on pattern surfaces. No worry about edge damaged by clamping.
Non-contact handling is available.
Applicable to various robot hands such as periphery suction hand or Bernoulli suction hand.
We can propose a method how to handle a warped wafer, based on verification.
We propose a unique method which saves the tape consumption and minimize the risk of dicing frames (tape frames) being damaged or metal powder being generated due to the contact between frames and cutters.
Applicable to different sizes and different tapes by a variety of recipe settings.
Applicable to various sizes of workpiece: For 4-,6-in, for 4-,5-,6-,8-in, for 6-,8-in
Option: Can be equipped with tape removing mechanism, UV irradiation unit, or vacuum mounting unit.