Semiconductor and Electronic component production equipment

Wafer Mounter

Wafer Vacuum Mounter

OVM-series

Low-damage mounting to fragile wafers!

time：1min 5sec

This device applies vacuum tape under a vacuum for mounting of workpieces and tape/film.

Simple set the dicing frame and workpiece with dicing tape applied, and operate the switches to mount tape to workpiece.

Tape mounting with low stress
Quantifies parameters for tape mounting conditions (Mounting speed, vacuum value, pressure difference, vacuum releasing speed)
One touch operation will perform tape mounting recipes.
Applicable to workpieces of different sizes by changeover.
Applicable to wafers of uneven surface such as TAIKO®※１.
Applicable to workpieces vulnerable to stress such as MEMS or thin wafers.
With the vacuum mounting unit installed to Full Automatic Model, mass-production is possible.
Attaches films/tapes to wafers/substrates. (Protection films or high-functioning films like dry film, or wafer mounting before the dicing process)
With the optional heater, a wafer can be warmed while in the tape mounting operation under a vacuum.
With the optional stage, tapes can be mounted with the pattern surface not being in contact.

We can demonstrate our products.
Consult with us if you are interested to make samples.

	8 inch	12 inch
Dimensions	W500 × D770 × H1010(㎜) （with adjuster）	W613 × D873 × H1035(㎜) （with adjuster）
Weight	Approx. 110 kg	Approx. 150 kg
Recipe settings	Choose from 10 types	Choose from 10 types
Work pieces suitable for processing	2inch∼8inch　Wafer substrate 5inch∼8inch　Dicing Frame	8inch . 12inch　Wafer substrate 8inch . 12inch　Dicing Frame
Tape used	Various tapes	Various tapes
Vacuum source	Dry pump	Dry pump
Dry air	0.5Mpa or more 150L/min(ANR)	0.5Mpa or more 150L/min(ANR)
Power source	AC200V　50/60Hz　15A (3-phase)	AC200V　50/60Hz　15A (3-phase)