This mounter is equipped with an attaching pressure adjustment function, allowing for clean attachments without differences among individuals.

A design to minimize the length of tape to be scrapped, considering the operating cost.

Used separator will be collected in the separator pipe with the automatic separator winding mechanism.

Its mount table is finished in Non-dhesive coating, enabling smooth detachment of tapes.

A design to minimize the length of tape to be scrapped, considering the operating cost.

The tape holder cover and the window of the circle cutter section are made of UV-cut resin.

Possible to process work pieces of different thickness by adding a mount table height adjuster.
Adjustable within ±1 mm.

To paste weakly-adhesive tapes, the table temperature can be adjusted. Applicable to DAF (Die Attachment Film) as an integrated model of dicing tape and die bond film.

An ionizer is available for the purpose of diminishing static electricity.
(Static electricity remover)

Possible to produce a wide array of mount tables which will suit for various work pieces.(Porous table, Universal table, others)
Can be customized for substrates or lead frames other than wafers.
We can also provide with a model applicable to BG tapes.