Patented non-contact tape mounting method utilizing pressure difference reduces stress on a workpiece.
Pre-cutting mechanism eliminates stress on a dicing frame; No dust generated!

OKK's uniquely designed pre-cutting system is employed. The yield ratio is improved by approximately 40% when normal tapes are used.
When compared to pre-cut tapes, the yield ratio is improved by 10%.

We can give you a solution to your issue as "We use tweezers to carry wafers, but we break them sometimes…"
The device having specifications of full-face suction and yet being see-through, you can suction and release a wafer while visually checking it. Work efficiency will be improved accordingly.

Have you ever broken a wafer while peeling off a tape? We can give you a solution to your issue with the specialized stage which suctions and fixes a wafer. It will be easier than operating the device.

The foot print is the smallest in size in the industry. Excellent investment effect with less space.